Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

SMTA Ultra High-Density Interconnect Symposium Is Nearly Here

02/27/2024 | SMTA
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.

ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event

02/27/2024 | ASC Sunstone
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.

ESA Exclusively Approves Ventec VT-901 Material in ACB Belgium's HDI Rigid PCB Qualification

01/30/2024 | Ventec International Group Co., Ltd.
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards.

IPC’s Advanced PCB Design Concepts Training Course

01/19/2024 | IPC
The Advanced PCB Design Concepts course, 6:30 to 8:30 p.m. EDT March 18 to May 15, 2024, with virtual classes held on Mondays and Wednesdays, will start with the design of HDI and advanced packaging concepts.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in