IPC Skills Challenge Competitions Return to India Region


Reading time ( words)

To commemorate IPC India’s decade of service to the electronics manufacturing industry, the IPC India team will hold skills challenge competitions and member networking events starting this November across different parts of the country. Winners of regional competitions will gather in Bengaluru and New Delhi in August 2022 to compete in PCB design, hand soldering and wire harness assembly championships. 

The skills challenge semi-final competition will take place on August 2 (Bengaluru) with championship taking place on August 4 (New Delhi) at Integrated Electronics Manufacturing Interconnections (IEMI) 2022. In addition to the skills championships, panel discussions and technical conference program sessions will focus on information communication technology on August 2 and on August 4, topics and discussions will focus on the defense and aerospace technology.

IPC Skills Challenge Phases:

November 2021 – March 2022 

  • Competitors from electronics companies send registration form to IPC India
  • As per IPC competition guidelines, companies organize hand soldering/wire harness assembly/PCB design challenges at their company premises using own tools/equipment
  • Companies can nominate observers/judges from own company if IPC certified individuals available, otherwise IPC will provide IPC certified observers/judges
  • IPC present certificates to winner and runner up at each company location

April 2022 – July 2022: IPC India will organize semi-final competition round with the winners of the first rounds at networking events at Hyderabad, Chennai, Pune, Bengaluru, Colombo (TBC) and New Delhi (August 2, 2022)

August 4, 2022: Final Round to be played in Bengaluru.

Share

Print


Suggested Items

John Mitchell: Focus on the Future

12/06/2021 | Barry Matties, I-Connect007
In a far-ranging interview, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges (and opportunities) facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong. We’re an industry that enjoys and needs to work together, and we’ve been held at bay for too long. "Throughout 2021, at every conference I’ve attended, people are really excited about seeing each other again," said Mitchell. "And since APEX EXPO is one of the premier events for the industry, that is the thing I’m happiest about—getting people back together again, getting them excited."

Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products

12/01/2021 | William Webb, ASTER Technologies
Achieving design for test (DFT) can be challenging for both design and test groups, as sometimes both expect that the other will be the one to manage DFT. The design and test groups might be in the same organization, or they could be an OEM vs. an EMS company. It works best if both the design and test groups are engaged in the process of DFT and trying to achieve the goal of the best test coverage and lowest rate of field returns.

Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 2

04/21/2021 | Sagi Reuven and Zac Elliott, Siemens Digital Industries Software
Companies have been collecting data in large volumes. Highly varied data from manufacturing operations comes in quickly that needs to be validated, and its value prioritized so that it can be turned into something useful—transformed from big data to smart data. The amount of data available has grown exponentially into big data. Twenty years ago, a PCB work order resulted in 100 data records, megabytes of data; today, it is 10 billion records, terabytes of data. The investment in collecting this data and storing it is high. However, without a way to analyze the data, without analytics, it will not result in ROI.



Copyright © 2022 I-Connect007. All rights reserved.