indie Semiconductor Expands Edge Compute, Perception-Enabled Vision Processing Capabilities
October 6, 2021 | Business WireEstimated reading time: 2 minutes
indie Semiconductor, Inc., an Autotech solutions innovator, has created a dedicated business unit focused exclusively on high quality perception-enabled, vision processing solutions to address the majority of usage cases for advanced driver-assistance systems (ADAS)-enabled vehicles. Ramesh Singh, an industry veteran, is leading indie’s new VisionQ business unit, which is supported by an exceptional team that together has already successfully brought millions of silicon, software and system solutions to the vision processing market over the last two decades. The group’s combined development capabilities, expertise in building large scale vision businesses and vast relationships worldwide position indie to deliver best-in-class sensing platforms for ADAS applications.
“Adding Ramesh and his team to the indie family represents a major step toward realizing our vision of becoming the leading semiconductor and software level solutions provider for multiple sensor modalities,” said Donald McClymont, co-founder and CEO of indie Semiconductor. “We plan to leverage their capabilities to create revolutionary devices with the lowest cost, power and form factor – redefining perception vision processing.”
“Joining indie allows our team to accelerate the adoption of an open software perception stack and create scalable designs that are power and performance optimized,” said Ramesh Singh, executive vice president and general manager of indie’s VisionQ business unit. “We are excited to bring our wealth of industry experience, deep understanding of the entire imaging ecosystem, strategic image sensoring partnerships and industrialization expertise under indie’s umbrella to deliver fully functional, differentiated solutions for our automotive customers.”
Enabling complex camera solutions with artificial intelligence (AI) functions are rapidly being adopted by major Tier 1s and OEMs as a way of bringing intelligence to solve difficult sensing problems. As the requirements for these compute functions increase, the integration within the power profile and the form-factor becomes even more challenging. Integrating the AI algorithms and sensing functions into the numerous automotive cameras requires intelligent edge-compute vision processing in practically every product to solve the varying levels of computational processing. indie believes ADAS solutions that integrate the perception stack (by fusing advanced sensing algorithms across vision, radar and LiDAR) will drive adoption of safety features being mandated globally.
According to Yole Development market research, the automotive camera market alone is expected to reach $7.7 billion by 2022, up from $2.2 billion in 2016, a compounded annual growth rate of approximately 24 percent, while the overall sensing market (camera, radar, LiDAR and ultrasound) is expected to reach $19 billion, up from $8 billion during the same time period.
Suggested Items
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
SEMI Applauds U.S. Chips Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply
03/21/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support four new Intel Corporation semiconductor manufacturing sites in the states of Arizona, New Mexico, Ohio and Oregon.
imec Inks MoU with the intention to Establish New 300mm R&D Process Line in Spain for Specialized Chip Technologies
03/20/2024 | ImecThe Spanish government, together with the regional government of Andalusia and imec, a world-leading research and innovation hub in nanoelectronics and digital technology, announced today that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialized chip technology pilot line in Malaga (Andalusia).
Intel, Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act
03/20/2024 | IntelThe Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.