PCB Designers Can Compete to Become IPC Design Champion of 2022


Reading time ( words)

IPC announces a new IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2022. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top contestants on January 25, 2022 at IPC APEX EXPO in San Diego, Calif.  

The preliminary heat will be held November 1, 2021 to December 1, 2021, allowing designers to use their preferred tools to complete a full board buildup within 30 days. Provided with only a schematic and a BOM (bill of materials), competitors will be judged against their interpretation and implementation of design per IPC standards and general DFX (design for excellence) principles. Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2022.

“Every year, design engineers spend hours completing and perfecting their designs. The IPC Design Competition gives us the chance to meet those designers and put their skills to the test,” said Patrick Crawford, manager, design standards and related industry programs. “We can’t wait to see the results and crown a design champion at IPC APEX EXPO.”

Registration for the IPC Design Competition is free, but space is limited to 20 contestants. Registration ends October 29, 2021. For more information, visit www.ipc.org/ipc-design-competition-2022.

 

Share

Print


Suggested Items

‘The Trouble with Tribbles’

06/17/2021 | Dana Korf, Korf Consultancy
The original Star Trek series came into my life in 1966 as I was entering sixth grade. I was fascinated by the technology being used, such as communicators and phasers, and the crazy assortment of humans and aliens in each episode. My favorite episode is “The Trouble with Tribbles,” an episode combining cute Tribbles, science, and good/bad guys—sprinkled with sarcastic humor.

IPC-2581 Revision C: Complete Build Intent for Rigid-Flex

04/30/2021 | Ed Acheson, Cadence Design Systems
With the current design transfer formats, rigid-flex designers face a hand-off conundrum. You know the situation: My rigid-flex design is done so now it is time to get this built and into the product. Reviewing the documentation reveals that there are tables to define the different stackup definitions used in the design. The cross-references for the different zones to areas of the design are all there, I think. The last time a zone definition was missed, we caused a costly mistake.

Why We Simulate

04/29/2021 | Bill Hargin, Z-zero
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.



Copyright © 2021 I-Connect007. All rights reserved.