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IPC announces a new IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2022. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top contestants on January 25, 2022 at IPC APEX EXPO in San Diego, Calif.
The preliminary heat will be held November 1, 2021 to December 1, 2021, allowing designers to use their preferred tools to complete a full board buildup within 30 days. Provided with only a schematic and a BOM (bill of materials), competitors will be judged against their interpretation and implementation of design per IPC standards and general DFX (design for excellence) principles. Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2022.
“Every year, design engineers spend hours completing and perfecting their designs. The IPC Design Competition gives us the chance to meet those designers and put their skills to the test,” said Patrick Crawford, manager, design standards and related industry programs. “We can’t wait to see the results and crown a design champion at IPC APEX EXPO.”
Registration for the IPC Design Competition is free, but space is limited to 20 contestants. Registration ends October 29, 2021. For more information, visit www.ipc.org/ipc-design-competition-2022.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools.
But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
Zachariah Peterson, NWES
Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.