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Chapter 1: Data Center Infrastructure and Requirements Related to Electronics Systems
System designers for 5G, automotive, high-performance computing (HPC), IoT, and other advanced applications have been facing growing challenges in EM interference and thermal issues. These are prevalent in all electronic devices. Data centers play a key role in this high-performance computing (HPC) era, and EMI/thermal issues have a huge impact on the performance of data centers. This book explains scenarios and issues based on the context of data center electronic systems.
The design, implementation, quality, and reliability guidelines as defined by the American National Standards Institute (ANSI) and the Telecommunications Industry Association (TIA) are critical considerations when developing leading-edge data centers. They directly translate into power, performance, area, integrity, and reliability requirements at every design and implementation stage of the electronic systems used to create the data center. Enterprises use data centers to house their business-critical applications and information from across the globe to aid better data management and security. The four main elements for the functioning of a computing environment are:
- Compute: Memory, local storage, and processing power
- Storage: Primary and backup storage devices Memory:
- Random access memory (RAM) and cache
- Networking: Equipment for connectivity ranging from routers and switches to controllers and firewalls
The high-density data flow and processing in data centers pose thermal and EMI issues at various levels in its computing environment. Hence it is extremely crucial to perform a thorough thermal/EMI analysis and optimization at the design level itself for every component at the individual as well as integrated level.
Data Center Categories
Data centers are classified into four main categories that serve different purposes depending on factors like destination, ownership, technology, and other characteristics.
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