April 2021 Issue of Design007 Magazine Available Now


Reading time ( words)

When we first started speaking with signal integrity experts for this issue, we were surprised to find that there were several schools of thought regarding simulation, including avoiding the use of simulation from the start. So, in the April issue of Design007 Magazine, we asked some of the industry’s premier experts on simulation to weigh in on this critical topic.

Download your copy today on the virtual newsstand or subscribe here for delivery in your email inbox. 

Share

Print


Suggested Items

Why We Simulate

04/29/2021 | Bill Hargin, Z-zero
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.

Alternatives to Simulation

04/23/2021 | Dan Beeker, NXP Semiconductors
We are living in an age where the demands on electronic product designs are constantly evolving. The IC technology and operating speeds continue to pose significant challenges for teams as they work to develop their products. The increased transistor switching speeds and less forgiving compliance standards make signal integrity and electro-magnetic compliance more difficult to achieve. The status quo seems to have become, “We expect to fail EMC testing.”

Bridging the Simulation Tool Divide

04/12/2021 | I-Connect007 Editorial Team
Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.



Copyright © 2021 I-Connect007. All rights reserved.