Simberian Releases Simbeor 2021.02


Reading time ( words)

Simbeor 2021.02 is now available for customers and trials. It provides unmatched productivity for electromagnetic analysis of serial PCB and packaging interconnects with the analysis to measurement correlation. 

Here are the highlights of the recent updates and new release: 

  • Up to 100 times greater acceleration of analysis of 3D structures with 3DML solver and fast interpolative sweep with no impact on accuracy, with the same analysis-to-measurement correlation as before
  • Automatic recognition and model re-use for vias and launches in post-layout decompositional analysis; extracted vias and launches can be further tuned in Via Analyzer or optimized with SiTune.
  • Acceleration of geometry import in Board Analyzer and geometry processing in DeComposer.
  • Simultaneous FD and TD analysis of viaholes, launches and other discontinuities, to see via TDR during the optimization enabled by improved interpolative sweep
  • Easy back-drilling setup in Via Analyzer
  • Wizard to unite geometries of PKG breakout, balls and PCB breakout for modeling as one discontinuity, enabled by the 3DML solver improvements
  • New productivity mode in Simbeor THz without most of the wizards
  • Simbeor SDK contains multiple new functions including everything to automate pre-layout analysis in C/Matlab or Python.

Simbeor 2021.02 is available now. More productivity improvement features will be released this year as continuous deployment of Simbeor 2021 continues—stay tuned.

For more information visit www.simberian.com or contact Simberian at info@simberian.com.


Share




Suggested Items

A Textbook Look: Signal Integrity and Impedance

05/18/2022 | Pete Starkey, I-Connect007
Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.

New Book From Isola Highlights Importance of Material Selection

01/14/2022 | I-Connect007 Editorial Team
In "The Printed Circuit Designer’s Guide to... High Performance Materials," the latest release from I-007eBooks, readers will learn how to overcome challenges associated with choosing the right material for their specific application. Author Michael Gay of Isola provides a clearer picture of what to know when determining which material is the most desirable for which products. PCB materials and DFM expert Mark Thompson says, “I love this book, particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and effective Dk."

TTM’s Approach to Stackup Design: Train the Customer

01/12/2021 | I-Connect007 Editorial Team
In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.



Copyright © 2022 I-Connect007. All rights reserved.