Just Ask Heidi: The Biggest Challenge for Design Engineers?


Reading time ( words)

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Heidi is a senior signal and power integrity engineer at Keysight Technologies. She has written over 20 papers on SI and PI, and she is an active member in developing the new IEEE P370 standard involving interconnect S-parameter quality after fixture removal. Heidi has been awarded five patents and a NASA Silver Snoopy award (each Silver Snoopy pin flies on a space mission first), and she was named DesignCon's 2017 Engineer of the Year. We hope you enjoy “Just Ask Heidi.”

Q: What do you consider to be the biggest challenge for PCB design engineers today?

A: I would have to say impedance, and the fact that electrical signals with fast digital edges and low voltages are much more sensitive to this than ever before. Designers need to start thinking in terms of return paths and impedance to better understand how layout can have an adverse impact on PCB performance. The engineering trade-offs can be quite complex between performance, cost, and risk. Innovative solutions often benefit from the ability of EDA tools to do pre-layout “what-if” simulations using measurement-based models and manufacturing tolerances.

To submit your questions for Heidi, click here.

Share

Print


Suggested Items

Book Excerpt: Producing the Perfect Data Package

06/03/2020 | I-Connect007 Editorial Team
The following is an excerpt from Chapter 1 of Mark Thompson's I-Connect007 eBook "The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package." Mark is in engineering support at Prototron Circuits and a Design007 columnist.

Mentor’s Cristian Filip Discusses His Award-winning DesignCon Paper

03/21/2019 | Andy Shaughnessy, Design007 Magazine
During DesignCon, I met with Cristian Filip, a senior product architect with Mentor, a Siemens business. Cristian had just received word that his paper had won a DesignCon Best Paper award—his second such award in three years. I asked Cristian to discuss his paper and how this technology can help improve manufacturing yields at high volumes.

Signal Integrity: The Experts Weigh In

11/14/2017 | The I-Connect007 Team
When we began planning the October issue on signal integrity, we arranged a conference call with a variety of industry experts. Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries joined editors Andy Shaughnessy, Patty Goldman, Happy Holden and Publisher Barry Matties on the call for a spirited discussion about the challenges related to signal integrity and some of the tricks of the trade for helping ensure SI.



Copyright © 2021 I-Connect007. All rights reserved.