Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’


Reading time ( words)

Chapter 2: IMPCBs or MCPCBs
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.

This chapter will focus on the IMPCB design considerations, and Chapter 4 will focus on RF thermal management. We will focus on things designers should be discussing with their PCB supplier to ensure manufacturability and a successful product launch. Since the choices, options, and decisions can be extremely complicated, it is critical to engage early and collaborate with the PCB fabricator about the specific design to ensure the most cost-effective solution.

Some of the more common applications of IMPCBs include:

  • Power Conversion: Thermal-clad offers a variety of thermal performances, is compatible with mechanical fasteners, and is highly reliable
  • LEDs: Using thermal-clad PCBs ensures the lowest possible operating temperatures and maximum brightness, color, and life
  • Photovoltaic Energy: Renewable energy to power telecommunications, military camps, residential and commercial structures, and battery charging stations
  • Motor Drives: Thermal-clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements
  • Solid-State Relays: Thermal-clad offers a very thermally efficient and mechanically robust substrate
  • Automotive: The automotive industry uses thermal-clad boards, as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization

To download The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, click here. You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.

Share

Print


Suggested Items

EIPC Technical Snapshot Review: Semi-additive Processes

12/01/2021 | Pete Starkey, I-Connect007
The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/05/2021 | Nolan Johnson, I-Connect007
A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.



Copyright © 2021 I-Connect007. All rights reserved.