Cadence Webinar: Addressing Interconnect Modeling Challenges


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Accurate SI/PI analysis requires ultra-accurate 3D model extraction. Cadence’s Clarity 3D Solver is enabling dozens of PCB and IC packaging teams to perform complex 3D model extractions and create ultra-accurate interconnect models for their most demanding SI/PI simulations, and up to 10X faster than the nearest legacy tool. 

This webinar will take you through two test cases—a system-level memory interface and a rigid-flex PCB design—with the following key takeaways:

  • Accurate power-aware SI simulations of system-level memory interface, enabled by 3D extractions of full memory bus
  • Simulation of Rigid-Flex PCB in both flat and folded states
  • Demonstration of what you miss when you do not simulate the folded state 

To register for this free webinar, click here.

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