September 2020 Issue of Design007 Magazine Available Now

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For much of the history of the printed circuit board, thermal management hasn’t exactly been top of mind for designers and design engineers. But with the growth of electric and autonomous vehicles, along with telecom and mil-aero applications, thermal management and thermal design processes are becoming mainstream. So, in this issue of Design007 Magazine, our expert contributors share their thoughts on the best methods to “beat the heat.”

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09/17/2020 | Andy Shaughnessy, Design007 Magazine

I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

09/09/2020 | I-Connect007 Editorial Team

The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

08/13/2020 | Happy Holden, I-Connect007

We asked for you to send in your questions for Happy Holden, and you took us up on it! We loved them so much, and we know that you did too, so we’ve compiled all 21 questions and answers into one document for easy reference.