Reading time ( words)
For much of the history of the printed circuit board, thermal management hasn’t exactly been top of mind for designers and design engineers. But with the growth of electric and autonomous vehicles, along with telecom and mil-aero applications, thermal management and thermal design processes are becoming mainstream. So, in this issue of Design007 Magazine, our expert contributors share their thoughts on the best methods to “beat the heat.”
Download your copy today on the virtual newsstand or subscribe here for delivery in your email inbox.
Share
PrintSuggested Items
Managing Footprints With Integrated EDA Tools
02/23/2021 |
Matt Walsh, Siemens Digital Industries Software
Electronics companies are always under great pressure to continually grow and innovate. In addition to navigating ever-accelerating design cycles, they must also address and overcome generational complexities associated with their products, the underlying components they use, and the human capital accountable for delivering on time and on budget. Electronics firms can ill afford the time and resource inefficiencies associated with manually correcting design errors, poor library data integrity, or other inconsistencies leading to missed deadlines or even costly re-spins.
A Library Management Cautionary Tale
02/12/2021 |
Steven V. Chavez, CID+
The library management of footprints, land patterns, or cells—however you refer to them in your ecosystem—is one of the most critical items in the foundation of any PCB or CCA design. When I was asked to write an article on this topic, so many thoughts and experiences instantly flooded my mind. After 30+ years of designing PCBs throughout the industry, I have my share of experiences and stories about footprints. One particular experience stands out.
Best Practices: Footprint Design and CAD Library Management
02/09/2021 |
I-Connect007 Editorial Team
The I-Connect team spoke with Altium’s John Watson about the hurdles surrounding footprints and footprint design. John talks about how being proactive and improving the CAD library can better QC processes and help protect against footprint difficulties.
