Most of our readers are familiar with our Real Time With... video program. For over a decade, our production teams have been a staple at trade shows and conferences around the world, from San Diego to Shanghai, doing on-camera interviews with the industry’s top technologists, managers, and executives.
Now, we've decided to shake things up a bit. Real Time With…I-Connect007 has turned the cameras around to focus on recent issues of our magazines. In this first installment of this new series, we invited four of our recent contributors—Dana Korf, Jen Kolar and Mark Thompson of Monsoon Solutions, and Kelly Dack—to review the June and August issues of Design007 Magazine, which covered app notes and fab notes, respectively.
In this wide-ranging roundtable, we discuss some of the ongoing challenges related to design data and why communication can preclude many of these problems.
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08/05/2022 |
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
06/30/2022 |
Nolan Johnson, I-Connect007
In this interview with Arjun Bangre, director of product for high-speed interface IPs for PCI Express and CXL at Rambus, the discussion revolves around new developments in CXL, PCI Express, and interoperable IP solutions that Rambus has developed.
04/26/2022 |
Cherie Litson, CID+, Litson1 Consulting
With components getting smaller and electronic devices becoming more compact, we are reaching the physical limits of the typical etched fabrication processes. To address these limits, new additive and semi-additive processes are being developed to fit into the current fabricators’ production lines without too much disruption or extra cost.
