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Performing post-layout verification of multi-gigabit SerDes channels is a challenging but necessary task, because even the most detailed pre-layout simulation studies and routing guidelines can’t anticipate everything. Designs that meet detailed routing requirements can still fail due to discontinuities and resonances that couldn’t have been anticipated.
The large numbers of channels in modern designs makes post-route verification difficult; each channel must be modeled and analyzed individually, which requires an automated, efficient process to be successful. Once modeled, each channel must be analyzed for compliance with protocol requirements in the same automated fashion. This September 8 webinar presented by Mentor, a Siemens business, will discuss requirements for effective SerDes channel post-route verification and show how they can be achieved.
- Different types of SerDes compliance analysis
- Compliance analysis using Channel Operating Margin (COM)
- Differences between COM analysis and IBIS-AMI simulation
- Different forms of Tx/Rx equalization and when they are effective
- How to identify areas of a SerDes channel that require 3D EM modeling
- How to isolate individual physical effects and determine their effect on system margin
- How to perform post-layout “what if” analysis for SerDes channels
- How to determine the impact of crosstalk on SerDes channel margins
Presenters are Min Maung, senior technical marketing engineer for HyperLynx software, and Todd Westerhoff, high-speed marketing manager.
September 8, 2020
10:00 AM - 11:00 AM Asia/Singapore
2:00 PM - 3:00 PM Europe/London
2:00 PM - 3:00 PM US/Eastern
To register, click here.
Nolan Johnson, I-Connect007
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools. But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.