EMA Design Automation Hosts 'High Density' Webinar


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EMA Design Automation hosts a free webinar entitled “High Density Interconnect—Addressing Complex and Dense PCB Designs,” from 2-3 p.m. EDT Thursday, Aug. 27.

This webinar will focus on ways to overcome common challenges with high density interconnect when designing a small and complex PCB.

Attendees will learn:

  • What is High Density Interconnect?
  • Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.
  • Challenges to consider when implementing HDI during the electrical and manufacturing stages
  • Basic HDI Design Guidelines 

Visit EMA online to register

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