Reading time ( words)
EMA Design Automation hosts a free webinar entitled “High Density Interconnect—Addressing Complex and Dense PCB Designs,” from 2-3 p.m. EDT Thursday, Aug. 27.
This webinar will focus on ways to overcome common challenges with high density interconnect when designing a small and complex PCB.
Attendees will learn:
- What is High Density Interconnect?
- Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.
- Challenges to consider when implementing HDI during the electrical and manufacturing stages
- Basic HDI Design Guidelines
Visit EMA online to register