Samtec Teams With SnapEDA to Deliver Symbols and Footprints


Reading time ( words)

Samtec now has over 200,000 symbols and footprints for its products to accelerate the design process for engineers.

Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints. Samtec and SnapEDA have teamed up to make these models readily available to engineers, because they both believe that engineers deserve the best in terms of ease-of-use, quality, and convenience.

In the second quarter of 2020, SnapEDA created over 120,000 new Samtec connector models, including high-speed and micro-pitch board-to-board, edge card, and rugged connectors. With these new connector models, engineers can now easily discover, and design-in Samtec products.

“Samtec is an inspiration when it comes to their dedication to the customer experience. Whether it’s their 24-hour free sample program, or their endless pursuit to expand the availability of design resources for their products, Samtec is truly world-class. These new models are yet another example of that dedication to their customers,” said Natasha Baker, CEO and founder of SnapEDA, based in San Francisco.

Connector models are highly sought-after by engineers, because they are incredibly time-consuming for which to create models. This is due to their non-standard bodies, custom solder stencils, fine pitches, irregular pad shapes, and cutouts. Accordingly, connectors are the third most popular category of components on SnapEDA.

“SnapEDA’s commitment to quality, innovation, and ease of doing business has made them a great partner for Samtec as well as our partners in the digital channel. They’ve enabled us to better serve our customers by offering quick and immediate access to hundreds of thousands of our most popular parts,” said Ashley Quinlan, Strategic Marketing Director at Samtec.

All models can be downloaded from Samtec’s website, samtec.com. They are also available on SnapEDA's site, snapeda.com, as well as through over a dozen of its collaborators including Digi-Key and Mouser Electronics.

Formats supported include Cadence OrCad, Allegro, Altium, Autodesk Eagle, Mentor PADS, KiCad, PCB123, and Proteus.

These new, high-quality models were created by SnapEDA’s Component Engineering team using proprietary, patented technology. They include accurate assembly, silkscreen, and contoured courtyards, and follow Samtec’s recommended PCB layouts and stencil patterns. Through-hole pads follow IPC-2221 standards using nominal drill hole sizes.

Share

Print


Suggested Items

Just Ask Happy: The Exclusive Compilation

08/13/2020 | Happy Holden, I-Connect007
We asked for you to send in your questions for Happy Holden, and you took us up on it! We loved them so much, and we know that you did too, so we’ve compiled all 21 questions and answers into one document for easy reference.

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

07/07/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technology for Ventec International Group. During their conversation, Chris discusses his group’s recent efforts to create new IMS materials, with a focus on dielectrics. As Chris explains, Ventec has developed several new dielectrics that can withstand much higher operating temperatures, one of which is UL-rated for a maximum operating temp of 155°C, which may be the highest for an IMS dielectric.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 2

06/16/2020 | I-Connect007 Editorial Team
The following is an excerpt from the second half of Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.



Copyright © 2020 I-Connect007. All rights reserved.