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We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What is the best way to resin-fill vias without voids?
A: I have not used this process a lot. In the past, partially filling surface vias with solder mask was sufficient. But now, with via-in-pad and stacked microvias, the filling process must be much more complete. Several machines on the market do this job very adequately and can be seen at the IPC APEX EXPO or SMTA International.
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Pete Starkey, I-Connect007
Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.
Luca Gautero, SUSS MicroTec
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.
Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers from the PCB manufacturer’s perspective, and the design decisions that will impact product reliability.