Enhanced System-level Engineering and Physical Design Efficiency in CR-8000 2020


Reading time ( words)

Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable contributions from academic research institutions such as UCLA or Fraunhofer IIS have also been incorporated into the release, particularly in the field of advanced packaging.

Key development themes for CR-8000 2020 were superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

  • Design efficiency benefits from significant enhancements in the areas of schematic design, FPGA optimization, skew group routing and support of back-drilled vias.
  • System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and ANSYS.
  • The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.

“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base”, says Kazuhiro Kariya, Managing Director of Zuken Inc., Yokohama. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and  process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of 3rd party design tools that are reaching their limits.”

The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs. Many legacy design tools are facing growing limitations, both in terms of system-level design and technology support.

Share

Print


Suggested Items

Real Time with… AltiumLive Europe: 21st-Century Tools Keynote

10/22/2020 | Pete Starkey, I-Connect007
Good morning, Europe!” Altium VP of Marketing Lawrence Romine said as he introduced the European edition of Altium’s PCB design conference—established as an annual must-attend event, but for 2020 presented in a virtual format. Pete Starkey brings you the details from AltiumLive Europe's opening keynote on 21st-century tools and what's coming in 2021.

Real Time with… AltiumLive 2020: Early Communication Key to Success of OSV Project

10/21/2020 | I-Connect007 Editorial Team
Rob Cooke, director of engineering at Calumet Electronics, discusses his role in the Open Source Ventilator (OSV) project that yielded ventilator PCBs in record time. He and project partners, Dugan Karnazes of Velocity Research and Chris Denney of Worthington Assembly, recounted this story during a panel at the virtual AltiumLive.

Real Time with… AltiumLive 2020: Greg Ziraldo on a New Approach to DFM

10/08/2020 | I-Connect007 Editorial Team
Andy Shaughnessy speaks with Greg Ziraldo, senior director of operations at Advanced Assembly, about his AltiumLive panel, "Design With Manufacturing." Greg discusses things that designers and electrical engineers should keep in mind regarding assembly during the design process, as well as a few ideas that he hopes attendees will take away.



Copyright © 2020 I-Connect007. All rights reserved.