Z-Zero Webinar June 30: Eric Bogatin on Engineering the PDN


Reading time ( words)

Please join Z-Zero on Tuesday, June 30, 202 as Dr. Eric Bogatin, Dean of the Teledyne LeCroy Signal Integrity Academy at Be The Signal and author of the best-selling book Signal and Power Integrity—Simplified presents "Engineering the Power Distribution Network," the next event in this ongoing webinar series. 

The power distribution network (PDN; sometimes also called the power delivery network) consists of all the interconnects from the voltage-regulator module (VRM) to the pads on the chip and the metallization on the die that locally distributes power and return current. This includes the VRM itself, the bulk decoupling capacitors, the vias, the traces, the planes on the circuit board, the additional capacitors added to the board, the solder balls or leads of the packages, the interconnects in the packages mounted to the board, the wire bonds or C4 solder balls, and the interconnects on the chips themselves.

The first and primary role of the PDN is to keep a constant supply voltage on the pads of the chips and to keep it within a narrow tolerance band, typically on the order of 5%. This voltage has to be stable, within the voltage limits, from DC up to the bandwidth of the switching current, typically above 1 GHz.

In this webinar, Dr. Bogatin will explore the entire PDN ecosystem, including both board and system-level tradeoffs.

EVENT: Engineering the Power Distribution Network
DATE: Tuesday, June 30, 2020
TIME: 10:00 AM - 11:30 AM Pacific Time 

If you can't make the time slot, just register and you'll be notified when the slides/recording are available.

To register, or for more information, click here.

Share




Suggested Items

A Textbook Look: Signal Integrity and Impedance

05/18/2022 | Pete Starkey, I-Connect007
Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.

Additive Manufacturing Requires Additive Design Techniques

05/09/2022 | Luca Gautero, SUSS MicroTec
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

DFM 101: Solder Mask and Legend

04/28/2022 | Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers from the PCB manufacturer’s perspective, and the design decisions that will impact product reliability.



Copyright © 2022 I-Connect007. All rights reserved.