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We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between.
Quite a few of you asked about issues related to vias. Here's an example:
Q: If I use a 0.1-mm via-in-pad (non-stacked vias), is it okay to leave the via unplugged on the basis that the via is blind and very short (no significant solder wicking)?
A: Under most situations, as long as the device connection (the ball on the BGA) does not "plug" the via, it will reflow smoothly. But check with the assembler, as their process may not work well with unplugged blind vias-in-pads.
To pose your question for Happy Holden, take the survey by clicking here.