Elsyca Offers Free Webinars on Simulation Tools for PCB Copper Balancing


Reading time ( words)

Elsyca has recently developed an exciting new technology for PCB CAM engineers and designers to validate their panel layout against plating targets and automatically add copper balancing. This results in panels with a more uniform layer thickness distribution and less plating related production problems.

These skills will give users a competitive advantage as it will enable them to meet customer needs more effectively than their competitors.

Elsyca also offers separate webinars for process engineers identify problems upfront and so that they may solve them before the implementation of a configuration and prior to production.

Details on upcoming webinars for PCB CAM engineers and designers can be found here.
Details on upcoming webinars for process engineers can be found here.

To watch the Elysca PCBBalance video and learn more now, visit elsycapcbbalance.com.

Share

Print


Suggested Items

This Month in PCB007 Magazine: Hiring Is an Investment in Your Business

12/16/2020 | Barry Matties, I-Connect007
Hiring is one of the most difficult processes in business. If you don’t get it right, you pay a heavy price. To get it right requires a well-defined process beyond just understanding the job description. It’s also important to understand the most important soft skill set you are looking for. For example, some of the most important skills may be the ability to solve problems, communicate well, organize tasks, and work with others.

Happy’s DIY Solution to Chemical Control

12/09/2020 | Happy Holden, I-Connect007
I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

11/30/2020 | Pete Starkey, I-Connect007
Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.



Copyright © 2021 I-Connect007. All rights reserved.