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Elsyca has recently developed an exciting new technology for PCB CAM engineers and designers to validate their panel layout against plating targets and automatically add copper balancing. This results in panels with a more uniform layer thickness distribution and less plating related production problems.
These skills will give users a competitive advantage as it will enable them to meet customer needs more effectively than their competitors.
Elsyca also offers separate webinars for process engineers identify problems upfront and so that they may solve them before the implementation of a configuration and prior to production.
To watch the Elysca PCBBalance video and learn more now, visit elsycapcbbalance.com.