-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Elsyca Offers Free White Paper On How Plating Simulation Raises Yield and Profitability
May 26, 2020 | ElsycaEstimated reading time: Less than a minute
Problems with non-uniformity in PCB copper pattern plating are typically described as "the FAB problem". But imagine how much time and money one could save when each player in the process (Design -> CAM -> Production) would be able to identify potential problems at an early stage.
What if the PCB pre-production engineer could upfront identify problem areas for the pattern plating and apply auto-intelligent copper balancing, as part of the CAM process to provide a right-first-time panel layout for production? And what if the process engineer has a software that accurately predicted the impact of plating parameters on the layer thickness distribution to increase first pass yields on new PCB parts?
Check out Elsyca’s new white paper to learn more about how you can save time and money with production-proofing your PCB copper plating.
To download this white paper now, click here.
Be sure to check out one of Elsyca's informative webinars. For more information, click here.
Suggested Items
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
EIPC Winter Conference 2024, Day 1: A Grab-bag of Technical Topics
02/12/2024 | Pete Starkey, I-Connect007The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.