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Copper plating is a very complex process that is impacted by the PCB design itself, by the panel layout and by the production configuration.
The ever-increasing complexity of the design and request to deliver in shorter amounts of time are even pushing experts to—and over—their limits.
In order to support the different players in this process, Elsyca has developed a new product suite for the PCB industry. One of the products, Elsyca PCBBalance will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
In regard to copper balancing and its importance, Rick Hartley, Principal Engineer of RHartley Enterprises commented, “Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.”
Elsyca’s PCBBalance simulation software allows users to master quality by providing detailed feedback on the layer thickness distribution and on top of that, also by generating the most performant copper balancing with a single mouse click.
The most critical areas on the panel will be identified, focusing testing resources on where they are most needed.
Key features include:
- Identify layer thickness distribution over boards and panels
- Automated and optimized copper balancing
- Identify the most critical holes for post-production quality testing
- Compare different PCB design and panel layouts side by side
- Download copper balancing results
Click on the appropriate link below to find out how this software will help you in your specific role as a PCB Designer, CAM Engineer or Process Engineer.
To learn even more about Elsyca PCBBalance, download a copy of their white paper or find out in one of their webinars how simple it works.
Britta Schafsteller, Atotech
Immersion tin is well accepted as a high-reliability final finish in the industry. Due to its excellent corrosion resistance, it exhibits major market shares, particularly in the automotive industry. During the soldering process, an intermetallic compound (IMC) is formed between copper and tin. One remaining concern in the industry is the potential impact of the IMC on the solderability of the final finish. In this article, typical failure modes in soldering immersion tin are described and correlated to potential root causes for the defects.
Nolan Johnson, I-Connect007
Candor Industries is a PCB fabricator investing in UHDI fabrication capabilities in Canada. To support advanced packaging, as well as the current pace of IC process shrinks, PCB fabrication capabilities must shrink to keep up. Sunny Patel, Candor’s technical sales manager, brings us up to speed on what Candor has learned in their journey to add UHDI. What we gain from this interview is that, while certainly not insignificant, the stretch to add UHDI may be not as far as one might think.
Nolan Johnson, I-Connect007
During a recent tour of the MKS facility in Beaverton, Oregon, I met with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick. As a reminder, MKS acquired ESI in 2019 and has retained the ESI brand. In this interview, they explain their approach to HDI and ultra HDI, the current state of base materials, and what the future looks like on the cutting edge of technology.