Sign Up Now for April 2 EMA Webinar on DDR Design Guidelines

Reading time ( words)

Each time a new generation of DDR is released, its performance capabilities are almost 2x superior to the previous generation. These technological advancements mean more difficult design requirements and tighter tolerances for PCB designers to navigate.

Join EMA Design Automation on April 2 at 3 pm Eastern time to learn how to overcome common challenges and helpful design techniques when incorporating DDR4 into your next design.

What attendees will learn:

  • DDR4 overview and structure
  • Common challenges when incorporating DDR into your design
  • Electrical and layout techniques to address the challenges
  • Defining and meeting constraint requirements
  • Verifying proper interface operation
  • What’s to come with DDR5

The webinar presenters are Jerry Long, product and senior applications engineer, and Orlen Bates, field applications engineer, both with EMA.

For more information, or to register, click here.




Suggested Items

Bridging the Simulation Tool Divide

04/12/2021 | I-Connect007 Editorial Team
Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.

Barry Olney’s High-Speed Simulation Primer

04/09/2021 | Barry Olney, In-Circuit Design Pty Ltd
The I-Connect007 editorial team recently spoke with Barry Olney of iCD about simulation. Barry, a columnist for Design007 Magazine, explains why simulation tools can have such a steep learning curve, and why many design engineers are still not using simulation on complex high-speed designs.

Eliminating ‘Garbage In, Garbage Out’ With Checks and Balances

03/26/2021 | Nick Barbin, Optimum Design Associates
The proverbial saying “garbage in, garbage out” holds true in the electronic product development world. PCB designers stand squarely in the middle of a busy information intersection flowing with inputs and outputs. Missing or bad information at the beginning of a design project will undoubtedly lead to board re-spins, increased costs, and most importantly, a delayed product release. The same can be said about the PCB designer who doesn’t provide a fully checked and comprehensive data package to the downstream manufacturers, i.e., “throwing it over the fence.”

Copyright © 2021 I-Connect007. All rights reserved.