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Watch Coatings Uncoated Webinar, Part 6 Now: Field Failures, Silicon vs. Sulfur
February 19, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The sixth episode of the popular webinar series, Coatings Uncoated, is now available to view. Based on an interesting case study concerning a telecommunications giant experiencing a high degree of field failures, coatings specialist Phil Kinner explains the mechanism behind the failures and why the silicone option proved unsuccessful. Part six of this micro webinar series concludes with a full explanation of the successful solution.
Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Watch the latest segment, “Circuit Failures Case Study: Silicone vs. Sulfur,” in under five minutes!
In this engaging, 12-part webinar series, Kinner delves even deeper into the subject, examining conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of, and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Most of the 12 segments can be viewed in five minutes or less.
Got five minutes? Visit http://iconnect007.com/webinar/cu/.
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03/26/2024 | IECPlease join IEC (International Electronic Components) in congratulating Dave Brooks on 25 years of service and camaraderie. As one of the original members of the IEC USA team, Dave is a valuable contributor to IEC's continued success.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/29/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
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Happy’s Tech Talk #26: Balancing the Density Equation
03/14/2024 | Happy Holden -- Column: Happy’s Tech TalkPrinted circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit