IPC APEX EXPO 2020 Attendees Speak: Sheryl Long


Reading time ( words)

Sheryl Long, global marketing communications manager for Rogers Corporation 

Nolan Johnson: What have your impressions been of IPC APEX EXPO 2020?

Sheryl Long: It’s a great place to see our customers and other friendly faces. The traffic has been a little slow this year, but it’s a great place to meet everybody at one spot and to get together and talk about what’s going on in the industry.

Johnson: What seems to be the attitude of the people attending?

Long: The coronavirus situation has put a lot of people at risk and is affecting some business, but everyone’s attitude is good and upbeat. The economy is doing well.

Johnson: What are some of the challenges that IPC APEX EXPO may be facing?

Long: Competition from other trade shows, such as DesignCon. Having competing shows in future years will be tough. Especially for companies that aren’t big enough to send people to both of them, they will have to pick and choose which ones they want to be at. And a lot of times, people like to be where the designers are.

To read this original interview, which appeared in Show & Tell Magazine, click here.

Share

Print


Suggested Items

I-Connect007 Editor's Choice: Five Must-Reads for the Week

10/09/2020 | Andy Shaughnessy, Design007 Magazine
It’s showtime! This past week, we saw quite a bit of news about virtual trade shows. It’s great to see show managers pivot from live, in-person events to virtual shows with only a few months to make it all happen. How would you like to be a show manager today?

Combatting Thermal Challenges With TRM Software

10/07/2020 | I-Connect007 Editorial Team
Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

Stop Relating Trace Temperature to Current Density

10/01/2020 | Douglas G. Brooks, PhD
Many design engineers and even many software suppliers make the significant mistake of equating changes in trace or via temperature with current density. This is incorrect at best and dangerous at worst. There is little if any correlation between temperature and current density. Current and trace dimensions (among other things) are the relevant variables, but current density is not. I hope by the end of this article you will see why. Here are four illustrations that will help you understand this.



Copyright © 2020 I-Connect007. All rights reserved.