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Rogers Corporation will be exhibiting in booth #3802 at IPC APEX EXPO in San Diego, CA Feb. 4th-6th, highlighting some of its next generation high performance circuit materials.
Technical Conference Presentations:
On the technical conference side, John Coonrod’s presentation: “High Frequency Materials & Related Concerns for Emerging Applications”, will take place on Feb. 5th, from 10:30 a.m. to 12 p.m. This is part of the Emerging Technology—Laminate Advancements for 5G technical session. On Feb. 6th from 10:30 a.m. to 12 p.m., John will present “Measuring the Impact of Test Methods for High Frequency Circuit Materials” as part of the Industry Advancements Related to Standards Updates technical session.
Visitors to Rogers’ booth will learn about:
TC350™ Plus Laminates for High Power Applications
TC350™ Plus ceramic filled PTFE-based woven glass reinforced composite materials provide a cost effective, high performance, thermally enhanced laminate for the circuit designer. With a thermal conductivity of 1.24 W/(m.K), this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates, resulting in lower manufacturing costs during circuit board fabrication.
The woven glass reinforcement combined with the high filler content of the laminate provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, high dielectric strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications.
RO4000® Products for Multilayer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.
RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
CU4000™ and CU4000 LoPro® Foils are sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable advanced connectivity and advanced mobility applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.