Updates on Cleaning Standards and Committees


Reading time ( words)

Graham Naisbitt of Gen3 discusses the changes he's seeing in cleaning, including how the WP-019 white paper has caused a closer look at electrochemical reliability. As a long-time head of committees, Graham also breaks down many of the topics he hopes are addressed at this year’s IPC APEX EXPO.

Nolan Johnson: Graham, even though so many members of this industry know who you are, I’m going to have you introduce yourself again.

Graham Naisbitt: On behalf of IPC and IEC, I am the vice-chair of the IPC 5-30 Committee, which embraces many different topics. I’m also vicechair or chair of both the SIR and the CAF test groups, and some major changes have taken place with the document that is used by the industry on how to assemble electronic circuits.

In October of 2018, J-STD-001 was changed with respect to Section 8 relating to cleaning, where we dropped the number that everyone has been relying on: 1.56 micrograms per centimeter squared of sodium chloride equivalence. The reasons for dropping that are covered comprehensively in the WP-019 white paper, which sets out the rationale for making these changes. It’s having a profound effect on the industry because with new products moving forward, we now have to look more closely at electrochemical reliability. Electrochemical reliability has become more and more relevant as the consequence of miniaturization in circuitry and circuit designs and working effectively in an increasingly hostile operating environment.

One of the challenges that the industry faces is that most process chemistries produced today have non-ionic additives that are used to aid wetting or de-wetting, as the case may be. These are not detectable by the existing or prevailing techniques. Insulation resistance testing, however, is something that has been used and embraced widely for at least the last 15–20 years, and I’ve been directly involved in most of the scientific research that originally kicked off around 1987 when we were dealing with the Montreal Protocol and the removal of CFCs, and that coincided with the introduction of no-clean processes.

To read this entire interview, which appeared in the January 2020 issue of SMT007 Magazine, click here.

 

 

Share

Print


Suggested Items

SMTA Additive TechXchange Keynote: An Outlook on Advanced PCB Fab

10/20/2020 | Pete Starkey, I-Connect007
Organised as a virtual event by Lenora Clark of ESI Automotive and Tara Dunn of Omni PCB, SMTA’s Additive TechXchange addressed additive technology specifically in the context of the electronics industry. Pete Starkey details the keynote presentation, an outlook on advanced printed circuit board fabrication, from Jeff Doubrava, managing partner at Prismark Partners.

This Month in SMT007 Magazine: Electronics Manufacturing—A Critical Industry and Supply Chain

07/01/2020 | I-Connect007 Editorial Team
Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington, D.C.

June Issue of SMT007: A Snapshot of a Resilient Industry

06/30/2020 | Tamara Jovanovic, Happiest Baby
Tamara Jovanovic, an electrical engineer at Happiest Baby in Los Angeles, never imagined that I would have to take half of my lab equipment home to be able to continue doing her job. As she says in her review of the June issue of SMT007 Magazine, the entire industry is adapting to the "new normal," and ready for whatever the future brings.



Copyright © 2020 I-Connect007. All rights reserved.