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Mentor Paper: Concepts of Signal Integrity—Impedance
December 27, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Successful signal integrity analysis depends on a fundamental concept: impedance. Without a thorough understanding of the impedance values that a signal encounters along the way, designers cannot maintain good signal quality from source to receiver.
This Mentor paper defines the difference between characteristic and instantaneous impedance and explores the essential principles of impedance and design-controlled impedance.
To download this paper by Mentor, a Siemens business, click here.
Suggested Items
Embedded World 2024: Rohde & Schwarz Presents its Cutting-edge Test Solutions for Embedded Systems
03/27/2024 | Rohde & SchwarzEmbedded systems are the foundation of today’s electronic devices, spanning sectors as diverse as consumer electronics, telecommunications, industrial, medical, automotive and aerospace applications.
Reassessing Surface Finish Performance for Next-gen Technology, Part 2
03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.
Beyond Design: Embedded Capacitance Material
02/22/2024 | Barry Olney -- Column: Beyond DesignEmbedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.
RoBAT Brings TDR Test to Bare and Assembled PCBs
02/19/2024 | Andy Shaughnessy, Design007 MagazineIn an interview at DesignCon, Gregory Miczek, global applications manager with RoBAT, discussed the company’s background and its expansion path from backplane defect analyzers to TDR testers for high-tech bare and assembled boards.
Connect the Dots: Controlled Impedance and Calculations for Microstrip Structures
12/28/2023 | Matt Stevenson -- Column: Connect the DotsModern high-speed and RF PCB design is an exciting field but comes with its own set of challenges. Signal integrity, performance, and crosstalk become major concerns. Designers for these types of projects need to learn how to control electromagnetic interference (EMI) and compatibility (EMC), which means utilizing some interesting math and calculations.