-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
December 18, 2019 | I-Connect007Estimated reading time: 1 minute
Learn how to ensure electrochemical reliability with The Printed Circuit Assembler’s Guide to… Process Validation—the latest title in our educational library. The Printed Circuit Assembler’s Guide to… is an ongoing series dedicated to educating those in the circuit board assembly sector, and serves as a valuable resource for electronics industry professionals seeking the most relevant information available.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability of the bare board can be achieved by using both CAF testing and SIR testing.
Dr. Lothar Henneken, senior expert and Six Sigma Blackbelt, automotive electronics at Robert Bosch GmbH, says, “The development of humidity-robust electronic components represents a central task of reliability engineering in view of increasing miniaturization, extended operating times (e.g., autonomous driving), and increasing loads (e.g., e-mobility). Suitable material selection, characterization, and qualification—with the help of CAF and SIR tests—are an important part of this, as is ensuring constant manufacturing processes; the control of which can be carried out by means of regular ionic contamination measurements, in addition to a quality management system.
Dr. Henneken continues, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner. The frequently recurring questions about influencing variables on SIR and CAF tests and their significance for material qualification are also summarized and well-founded.”
This is a must-read for those in the industry who are concerned about ECM—especially in automotive—as well as those who want to adopt a better and more rigorous approach to ensuring electrochemical reliability and deal responsibly with the subject of humidity robustness through new, valid, state-of-the-art material and process qualification.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Validation.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Suggested Items
PCBflow Helps Designers Choose Best Manufacturer for the Job
03/28/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with a few technologists who have first-hand experience with PCBflow: Susan Kayesar, technical product manager with Siemens; Evgeny Makhline, CTO of Nistec, a CEM based in Israel; and Peter Tranitz, senior director of technology solutions and leader of the IPC Design Initiative. They explain how PCBflow functions, from the designer’s and manufacturer’s viewpoint, and how this database helps break down the wall between these stakeholders.
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.