-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Flex Standards Update With Nick Koop
November 21, 2019 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.
Andy Shaughnessy: Nick, tell us a little about your background and your work with flex and rigid-flex circuits at TTM.
Nick Koop: I’ve worked in the flex and rigid-flex world since 1985 where my roles have ranged from process engineer to design engineer to general manager of a factory. And I’ve been with TTM since 2013. It has been a great experience working with such a wide range of customers and programs, solving problems that lead to success for our customers.
Shaughnessy: You’re the vice-chair of the Flexible Circuits Committee and co-chair of the 6013 Subcommittee. Give us some updates on the flex committees.
Koop: All of the flex specifications are being reviewed on an ongoing basis. We are close to releasing new versions of IPC-2223 and IPC-6013. They will include more information on microvias, finished copper thickness, and other member-requested updates. I would expect that to happen by early 2020. The supporting material specifications and test methods are also under review. In addition, there is work happening on the T-50 Terms and Definitions Guideline, which is in the middle of a substantial update. So, there is a lot happening on all fronts.
Shaughnessy: We talk to a lot of rigid board designers who are being forced into flex design. Usually, they start with flex standards, and then hopefully, they will call a flex board shop. What advice would you give any rigid folks moving into the flex world?
Koop: We are also seeing dramatic growth in flex use driven by several factors; space, weight, reliability, and cost being some of the most common. Flex provides a lot of advantages over a rigid board and discrete wiring. My initial advice would be to gain an understanding of the similarities and differences. The key differences are unique materials and a variation in material movement, which can impact alignment.
To read this entire interview, which appeared in Flex007 in the September 2019 issue of Design007 Magazine, click here.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.