Cadence Presented with Four 2019 TSMC Partner of the Year Awards


Reading time ( words)

Cadence Design Systems, Inc. (NASDAQ: CDNS) was presented with four TSMC Partner of the Year awards at the TSMC 2019 Open Innovation Platform® (OIP) Ecosystem Forum. Cadence achieved recognition for the joint development of the N6 design infrastructure, SoIC design solution, cloud-based productivity solution and DSP IP.

These awards were given to Cadence based on the following work that has been delivered:

N6 design infrastructure: Cadence participated in an in-depth collaboration with TSMC on the design infrastructure development of this advanced process technology and has been working with customers on N6 design starts both on production designs and test chips.

SoIC Design Solution: Cadence collaborated with TSMC on the development of a design solution and delivered a reference flow that includes a full suite of Cadence® digital and signoff, custom/analog, and IC package and PCB analysis tools.

Cloud-based TSMC OIP Virtual Design Environment (VDE): Cadence collaborated with TSMC to add the CloudBurst™ Platform to Cadence-managed OIP VDE environments, elevating ease of use and enabling mutual customers to tape out advanced process designs using digital, custom and verification flows delivered via the cloud to improve overall productivity and meet compressed schedules.

DSP IP: Cadence worked with TSMC to enable customers to complete successful projects using the Cadence Tensilica® DSP IP, a widely-used DSP IP in the TSMC portfolio.

“Our continued collaboration with Cadence is enabling our customers to utilize our advanced technologies to design with confidence and meet design goals,” said Suk Lee, TSMC senior director of the Design Infrastructure Marketing Division. “We look forward to seeing our customers unleash their silicon innovations in their respective markets using our advanced N6, TSMC-SoIC®, cloud, and DSP IP solutions.”

“Through our close collaboration with TSMC, we’re enabling mutual customers to consistently deliver successful innovations using our latest technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “These awards from TSMC exemplify Cadence’s commitment to delivering upon its Intelligent System Design strategy, which enables customers to achieve SoC design excellence.”

Share




Suggested Items

What Happens When You Assume?

07/05/2022 | I-Connect007 Editorial Team
What is design with manufacturing and what does true DWM look like in operation? In this interview, I-Connect007 columnist Dana Korf explains what it will take to achieve total communication among all the stakeholders in the PCB development cycle. He also stresses the need for everyone involved in PCB design and manufacturing to stop making assumptions, even at the risk of being labeled as “that guy” who asks too many questions.

Master the Art of Communication With Manufacturers

06/30/2022 | Kyle Burk, KBJ Engineering
As mentioned in the May issue of Design007 Magazine, design is performed, at times, in a vacuum. But it doesn’t have to be that way. Whenever circumstances allow, design should be performed by communicating with all stakeholders throughout the design process, hence the emphasis on the word with in DWM. Communication can occur through personal correspondence such as email and voice conversations or through more formal design meetings—in person or through videoconferencing. No matter which means of communication you prefer, it’s important to communicate early and often with stakeholders involved in the downstream processes as you bring your project to realization.

Altimade Puts Designers and Manufacturers Together

06/24/2022 | Andy Shaughnessy, Design007 Magazine
Despite all of the talk about the need for communication between designers and manufacturers, many PCB designers still do not talk with their manufacturers for a variety of reasons. Altium and MacroFab aim to change this dynamic. In this interview, Ted Pawela, chief ecosystem officer of Altium and head of Altium’s Nexar Business Unit, and MacroFab CEO Misha Govshteyn, discuss the new Altimade manufacturing service that Altium is introducing in partnership with MacroFab. Ted and Misha provide an overview of the Altimade process, how it links designers to fabricators, assembly providers, and component distributors, and they explain how it could pave the way for true design with manufacturing, or DWM.



Copyright © 2022 I-Connect007. All rights reserved.