Words of Advice: Drawbacks to Your PCB Data Format?


Reading time ( words)

In a recent survey, we asked the following question: What is the biggest drawback to your current PCB data format? Here are a few of the answers, edited slightly for clarity.

  1. You would have to ask the board shop about that. They never complain about what I give them.
  2. Most suppliers and defense contractors and defense customers in the US are stuck on the Gerber format. ODB++ has its advantages, I agree, but PCB and EMS suppliers are not investing in the software infrastructure to support any of the more inclusive formats like ODB++, IPC-2581 or X2. We are in the midst of a two-year ongoing battle to change to ODB++.
  3. A common interface standard. IPC-2581B is a very comprehensive neutral standard for the interchange of PCB design, fabrication and assembly data, particularly the description of the board stackup, which until now has had no formal standard. But everyone in the industry needs to adopt it.
  4. The laminate structure and thickness is only described in PDFs of our drawings.
  5. Non-descriptive naming conventions and missing data!

Share

Print


Suggested Items

Mentor and Z-zero Collaborate on New Stackup Tool

09/17/2020 | Andy Shaughnessy, Design007 Magazine
I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi

09/09/2020 | I-Connect007 Editorial Team
The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

The Pros and Cons of Working Remotely

08/17/2020 | Patrick Crawford, IPC
For this issue of Design007 Magazine, Managing Editor Andy Shaughnessy asked Patrick Crawford if IPC had any insight into how the “new normal” of working from home has impacted their members. Here is what the IPC technical staff had to say about the advantages and disadvantages of working remotely, as well as working with IPC volunteers who are new to working from the dining room table.



Copyright © 2020 I-Connect007. All rights reserved.