-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
The Impact of Inductance on Impedance of Decoupling Capacitors
August 8, 2019 | Chang Fei Yee, Keysight TechnologiesEstimated reading time: 1 minute
This article discusses the impact of interconnection inductance on the impedance of the decoupling capacitor, which influences the power integrity of the PCB. The investigation is performed with 3DEM simulation by varying the trace length and height of stitching vias that connect the decoupling capacitor across the power rail and ground.
On a PCB, a power distribution network (PDN) with low impedance across the wideband is required to transfer power with low switching noise and high stability from the supply to the digital and analog ICs. Each decoupling capacitor—together with its interconnection inductance—are the major factors that contribute to the impedance of the PDN on a PCB. As shown in the cross-sectional view of the PCB depicted in Figure 1, interconnection inductance is formed by the traces and stitching vias hooking up the decoupling capacitor across the power rail and ground (e.g., Loop 1, Loop 2, and Loop 3). This parasitic inductance is directly proportional to the stitching via height and trace length, as governed by Equations 1 and 2, respectively.
Furthermore, referring to the directly proportional relationship between impedance and interconnection inductance in Equations 3 and 4, it is crucial to keep the interconnection inductance low to minimize the impedance of the PDN, which is achievable by reducing trace length and stitching via height.
To read this entire article, which appeared in the July 2019 issue of Design007 Magazine, click here.
Suggested Items
T-Global Technology Offers Solutions for Thermal Management Challenges
04/10/2024 | I-Connect007 Editorial TeamJames Hopkins from T-Global discusses the company's focus on thermal management products, including thermal interface materials, heat sinks, and thermal simulation services. He highlights the importance of collaborating with mechanical engineers and addressing challenges in balancing thermal performance and mechanical requirements. Hopkins also mentions the role of thermal simulation in guiding product recommendations and the significance of early collaboration among stakeholders for optimal product outcomes.
The Exploration Company Leverages Ansys to Promote Sustainability in Space
04/05/2024 | ANSYSSpace logistics startup The Exploration Company is advancing sustainable space exploration by leveraging Ansys simulation solutions to develop its modular and reusable space vehicle, Nyx.
Ansys Forms OEM Partnership with SynMatrix to Accelerate RF Filter Design
04/01/2024 | ANSYSAnsys announced a new OEM partnership with SynMatrix to streamline RF filter design workflows for wireless communications applications. SynMatrix develops industry-leading RF filter design and optimization tools that integrate with HFSS electromagnetic simulation.
Altair SimSolid Transforms Simulation for Electronics Industry
03/29/2024 | AltairAltair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.
Ansys, NVIDIA Pioneer Next Era of Computer-Aided Engineering
03/29/2024 | ANSYSAnsys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.