AGI and ANSYS Collaboration Streamlines Hypersonic Weapon Design


Reading time ( words)

To engineer the U.S. military's next-generation missile defense system, Analytical Graphics, Inc. (AGI) and ANSYS are incorporating high-fidelity, multiphysics simulations with multi-domain mission-level modeling into early stages of missile defense system development — effectively enabling warfighters to combat high-speed, highly maneuverable hypersonic weapons.

The U.S. Department of Defense (DoD) has made counter-hypersonics a priority. To rapidly find, track and eliminate these threats, systems for missile defense and their related command and control infrastructure must be upgraded and fully interconnected. High-fidelity, multiphysics engineering simulation is needed early in the design cycle to conduct critical architectural and mission analysis.

To satisfy this urgent national security need, AGI has embedded ANSYS' high-fidelity, physics-based component models within its own expansive, multi-domain mission-level modeling. Providing an integrated system across key engineering and mission analyses will eliminate problematic engineering bottlenecks. Physics-based solvers expedite missile defense system development by more accurately predicting communication blackouts, forecasting vehicle trajectory and altitude control, calculating thermal field effects on antenna performance, and analyzing other scenarios.

"Historically, system development has been compartmentalized, with components developed within black box silos. Counter-hypersonics requires the connection of these black box systems at design inception," said Kevin Flood, vice president of engineering at AGI. "AGI and ANSYS look forward to interconnecting these systems, incorporating a high level of engineering fidelity into their architecture analysis and mission analysis."

"Engineering and modeling highly complex and integrated missile defense systems presents tremendous challenges," said Joseph Cole, Vice President, Federal, Aerospace and Defense at ANSYS. "AGI and ANSYS are helping both our DoD agency customers and their prime contractors address these challenges by incorporating ANSYS' detailed multiphysics simulations within multi-domain mission models. With this partnership the same high-fidelity physics models that our customers use to reduce design time, enhance reliability and streamline maintenance operations can now be leveraged to increase the accuracy of mission level modeling and simulations as well."

AGI and ANSYS will discuss their ability to incorporate high-fidelity, multiphysics engineering simulation into mission-level modeling at the Space and Missile Defense Symposium in Huntsville, Ala. A similar demonstration will be featured in an August 21 webinar.

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit www.ansys.com for more information.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/17/2022 | Andy Shaughnessy, Design007 Magazine
We’re still not officially into summer yet, but Atlanta is bringing the heat, baby! It’s hit 97 degrees a few times this week, and I now have a fan aimed right at my face. At least it’s nice and humid too. I’m glad I don’t wear make-up. And it’s been a hot week in the circuit board community. This week, Eltek reported a fire at a board shop in Israel, and Flex committed to building a 145,000-square-foor facility in Jalisco, Mexico to serve the electric and autonomous vehicle segment.

Additive Design: Same Steps, Different Order

04/12/2022 | I-Connect007 Editorial Team
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.

AltiumLive 2022: Left-Shifting Modeling and Simulation

03/10/2022 | Andy Shaughnessy, I-Connect007
Harry Kennedy and Sarmad Khemmoro of Altair recently spoke with Andy Shaughnessy about their AltiumLive presentations, which are now available online. They discuss the need for modeling, simulation, and verification in PCB design, and why these actions should be performed as early in the design process as possible.



Copyright © 2022 I-Connect007. All rights reserved.