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System-In-Package Tools Lacking, Users Say
January 25, 2007 |Estimated reading time: Less than a minute
System-in-package (SiP) may be an increasingly attractive alternative to systems-on-chip (SoCs), but EDA tool support is sorely lacking, according to user panelists at the Fabless Semiconductor Association (FSA) SiP Conference here Wednesday (Jan. 24). And it's not just a matter of point tools, panelists said, but the development of an integrated design flow across ICs, packages and pc-boards. <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />