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In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are just a few of the answers, edited slightly for clarity.
1. The signal integrity of signal paths through both flex and rigid parts of rigid-flex PCBs.
2. Understanding how to design a flexible PCB that is easily manufacturable and robust.
3. None. We design them correctly!
4. Mechanical dimensioning and sizing to fit the required application.
5. Our designers need to learn more about the FPC fab process.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools.
But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
Zachariah Peterson, NWES
Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.