Mentor Webinar April 11: How to Model Thermal Vias


Reading time ( words)

In electronics product design, PCB thermal management that ensures adequate component cooling is important for reliability. Demands for compact designs and reduced costs drive a need for accurate and early evaluation of cooling options during design ideation phase.

Thermal vias offer opportunities to enhance heat dissipation away key components on a PCB. Register now for a new webinar on April 11, 2019, and learn how to model thermal vias quickly and accurately at different stages of PCB design.

Two live sessions are available April 11. Topics include:

  • How thermal vias can assist in heat dissipation on a PCB
  • How to model thermal vias during development; simple to explicit detailed approaches
  • Methods applied to an example model of a component mounted on a PCB with thermal vias

To register, click here.

 

Share

Print


Suggested Items

Managing Footprints With Integrated EDA Tools

02/23/2021 | Matt Walsh, Siemens Digital Industries Software
Electronics companies are always under great pressure to continually grow and innovate. In addition to navigating ever-accelerating design cycles, they must also address and overcome generational complexities associated with their products, the underlying components they use, and the human capital accountable for delivering on time and on budget. Electronics firms can ill afford the time and resource inefficiencies associated with manually correcting design errors, poor library data integrity, or other inconsistencies leading to missed deadlines or even costly re-spins.

A Library Management Cautionary Tale

02/12/2021 | Steven V. Chavez, CID+
The library management of footprints, land patterns, or cells—however you refer to them in your ecosystem—is one of the most critical items in the foundation of any PCB or CCA design. When I was asked to write an article on this topic, so many thoughts and experiences instantly flooded my mind. After 30+ years of designing PCBs throughout the industry, I have my share of experiences and stories about footprints. One particular experience stands out.

Best Practices: Footprint Design and CAD Library Management

02/09/2021 | I-Connect007 Editorial Team
The I-Connect team spoke with Altium’s John Watson about the hurdles surrounding footprints and footprint design. John talks about how being proactive and improving the CAD library can better QC processes and help protect against footprint difficulties.



Copyright © 2021 I-Connect007. All rights reserved.