Zuken Launches 3D Harness Design Solution


Reading time ( words)

Zuken introduces E3.WiringSystemLab, a new software solution that enables the optimization of complex wire harness designs based on inputs from heterogeneous sources. The product can import connectivity information from a broad range of sources and consolidates them with 3D topology data. The resulting 3D topology can be evaluated and optimized in a consistent 3D environment that has been designed to support the needs of casual users without requiring specialized training. Specialized functionality tailored specifically to topology exploration provides the ability to create and evaluate different architectural concepts.

Connectivity data can be imported from E3.cable, as well as via industry standard formats such as KBL, VEC, PLMXML, or even generic Excel® files. Topology information is imported in the form of geometrical bundles defined in the MCAD systems like CATIA, NX or Creo. Based on these inputs, E³.WiringSystemLab provides the ability to host the complete wire harness optimization process within in a consistent 3D environment. Comprehensive modifications can be applied to the imported harness, including changes of packaging, partitioning into sub-harnesses and insertion of new routing pathways.

“Optimizing wire harness designs to meet targeted weight and cost objectives is a complex and challenging task”, comments Reinhold Blank, Zuken Business Director for Automotive & Transportation. “In particular, the preparation of data that typically involves a laborious flattening to 2D has been a huge time sink for the industry. With E3.WiringSystemLab we are providing a solution that revolutionizes the import and consolidation of data sources from different origins and supports wiring system experts to optimize their complex designs in a modern 3D environment.“

With its generic cost and weight evaluation and exploration capabilities, Zuken’s E3.WiringSystemLab achieves a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.

Zuken’s new harness topology optimization E3.WiringSystemLab will be presented at the following events:

    USA: Zuken Innovation World Americas
    Hilton Head, SC, April 15 – 17, 2019
    Europe: Automotive Wire Harness Conference
    Ludwigsburg, Germany, March 26–27

Zuken1.jpg

E3.WiringSystemLab provides optimization capabilities of imported wire harness designs: add/delete bundles and route pathways (1), change position of components, splices and ground bolts (2), modify partitioning of harnesses (3)

Zuken2.jpg

With easy-to-use cost and weight evaluation and modification capabilities, Zuken’s E3.WiringSystemLab enables a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.

About Zuken

Zuken is a global provider of leading-edge software and consulting services for electrical and electronic design and manufacturing. Founded in 1976, Zuken has the longest track record of technological innovation and financial stability in the electronic design automation (EDA) software industry. The company’s extensive experience, technological expertise and agility, combine to create world-class software solutions. Zuken’s transparent working practices and integrity in all aspects of business produce long-lasting and successful customer partnerships that make Zuken a reliable long-term business partner. Zuken is focused on being a long-term innovation and growth partner. The security of choosing Zuken is further reinforced by the company’s people—the foundation of Zuken’s success. Coming from a wide range of industry sectors, specializing in many different disciplines and advanced technologies, Zuken’s people relate to and understand each company’s unique requirements.

Share

Print


Suggested Items

Roundtable Discussion: App Notes and Fab Notes

11/09/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently invited four recent contributors—Dana Korf, Jen Kolar, Mark Thompson, and Kelly Dack—to review the June and August 2020 issues of Design007 Magazine, which covered app notes and fab notes, respectively. In this wide-ranging roundtable, the group discusses some of the ongoing challenges related to incomplete and inaccurate design data and why communication can preclude many of these problems. What follows is the transcript from this conversation.

Combatting Thermal Challenges With TRM Software

10/07/2020 | I-Connect007 Editorial Team
Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

The Role of EDA Tools in Creating Fab Notes

09/08/2020 | Pat McGoff, Mentor
When discussing fab notes, there’s a lot of focus on what designers should and should not include in the package. But what is the role of EDA tools in this process, and can intelligent data formats streamline the tasks and help eliminate fab notes that are less than fantastic? In this interview, Pat McGoff, market development manager for Mentor, a Siemens Business, speaks frankly about fab notes and what EDA tool companies like Mentor can do to automate this process.



Copyright © 2020 I-Connect007. All rights reserved.