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Development of Multilayer Flex Substrates Using Liquid Crystal Polymer Film
January 25, 2007 |Estimated reading time: Less than a minute
Due to the prevalence of wireless Local Area Network (LAN) and electrical mobile devices such as cellular phones, personal digital assistants and notebook personal computers, massive and fast data transmission for handling sound and pictures is required in the very small size of a semiconductor package.<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
Substrates for packages are becoming smaller and thinner, accommodating more I/O terminals with appropriate electrical properties. This article discusses the possibility of manusfacturing highly dense, reliable substrate with Liquid Crystal Polymer (LCP) material. Electrical properties in high frequency are compared with conventional substrates.