Words of Advice: Fabricator Feedback?


Reading time ( words)

In a recent Design007 Survey, we asked the following question: What is the most important feedback that you receive after your board is manufactured? Here are just a few of the answers, edited slightly for clarity.

Karl Bates, ConnectPCB: Clearance is less than I expect, copper balance, and thieving.

Chand Basha M, Anora Semiconductor: We could not plate the board to required plating thickness. We had to reduce few pad sizes to adjust the fabrication process. A few mechanicals in the design are altered slightly due to capability issues.

Jim Pierce, Axiom Electronics: Impedance specifications, testing results, and documentation.

Share

Print


Suggested Items

Development of Flexible Hybrid Electronics

08/14/2019 | Weifeng Liu, PhD, Flex
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.

Altium Designer 19.0 Features Printed Electronics Design Functions

08/08/2019 | Andy Shaughnessy, Design007 Magazine
The newest version of Altium Designer—revision 19.0—includes functionality for designing printed electronic circuits. We wanted to get the scoop on Altium’s PEC tools, so we asked Nikolay Ponomarenko, Altium’s director of product management, to give us a tour of the new functions.

IPC High-reliability Forum and Microvia Summit Review, Part II

08/06/2019 | Pete Starkey, I-Connect007
The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.



Copyright © 2019 I-Connect007. All rights reserved.