Words of Advice: Fabricator Feedback?

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In a recent Design007 Survey, we asked the following question: What is the most important feedback that you receive after your board is manufactured? Here are just a few of the answers, edited slightly for clarity.

Karl Bates, ConnectPCB: Clearance is less than I expect, copper balance, and thieving.

Chand Basha M, Anora Semiconductor: We could not plate the board to required plating thickness. We had to reduce few pad sizes to adjust the fabrication process. A few mechanicals in the design are altered slightly due to capability issues.

Jim Pierce, Axiom Electronics: Impedance specifications, testing results, and documentation.

02/25/2021 | Andy Shaughnessy, Design007

Andy Shaughnessy chats with Lawrence Romine about Altium’s new subscription model for their Altium 365 platform. They discuss what this means for existing and future Altium customers, and some of the drivers leading to this development, including evolving use patterns among customers during the pandemic.

02/01/2021 | Eric Bogatin, University of Colorado, Boulder

Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.

01/12/2021 | I-Connect007 Editorial Team

In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.