January 2019 Issue of Design007 Magazine Available Now


Reading time ( words)

The component shortage is getting crazy. Some PCB designers are finding their favorite capacitors on 50-week and 80-week lead times, or worse. How do you design a board today when the components you need won’t be available for a year or more?

But don’t expect any sympathy from component suppliers; they’ve watched their profit margins continue to shrink over the years, and in their eyes, the OEMs have been reaping the rewards.

Where does this leave you and your next design? In the January 2019 issue of Design007 Magazine, we asked our expert contributors to explain the current component shortage, as well as some of the workarounds that can help you get your next design out the door sooner rather than later.

Check out this month’s issue of Design007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.

For future reference, be sure to download the PDF version

Share

Print


Suggested Items

Words of Advice: What are Your Biggest Design Challenges?

03/11/2019 | Andy Shaughnessy, Design007 Magazine
In a recent survey, we asked the following question: What are your biggest design challenges? Here are just a few of the answers, edited slightly for clarity.

The Electronic Component Shortage Crisis: A Veteran Engineer’s Perspective

02/18/2019 | John Watson, CID, Legrand Inc.
From where we stand now, at the beginning of 2019, we see lead times for some components in the short range of up to 16 weeks; medium-to-high is 32 weeks, and long lead times are as far out as 80 weeks. In other words, if we ordered a component today, it would arrive in over a year a half from now (maybe). This all started with the capacitors (we will see why later), but we now see other component series being sucked into this problem.

Streamlining Thermal Design of PCBs

01/10/2018 | Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.



Copyright © 2019 I-Connect007. All rights reserved.