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Mentor, a Siemens business, has announced an upcoming workshop on "Virtual Prototype with HyperLynx" on January 18, 2019 at 9:00 a.m. - 4:30 p.m. IST, Bangalore India.
Do you want to create competitive advantage across your enterprise? Attend this 1-day HyperLynx free workshop to understand how.
Ask any signal integrity expert, what keeps you awake at night? Most will agree that it’s the question of being 100% certain that their design will work in real life.
With the increased complexity and high-speed performance of today's integrated circuits (ICs), a growing number of PCBs suffer from signal degradation and timing problems which are exacerbated by power delivery issues; this impacts board performance and possibly total failed logic, requiring costly redesign.
HyperLynx offers a complete suite of design analysis and verification software that meets the needs of PCB engineers at any point in the board design flow, addresses high-speed systems design problems throughout the design flow— starting at the earliest architectural stages through post-layout verification. Easy to use and integrate into your flow, HyperLynx equips hardware design engineers and PCB designers to efficiently analyze, identify, resolve, and verify critical design issues, which prevents costly re-spins, reduces design cycle times, and improves product reliability. Achieve greater innovation, faster time-to-market, and decreased costs with HyperLynx.
Visit I-007eBooks to download your copies of Mentor’s books today:
The Printed Circuit Designer’s Guide to… Signal Integrity and Power Integrity by Example.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools. But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
To give readers a sample of 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design,' by Bill Hargin, we are providing the book's introduction. He writes, "Another book about stackups? If you’re asking this question, I’d like to know the book you’re thinking of, as I was looking for it a few years back. I have a pretty good PCB signal integrity (SI) library, and I’ve only found one chapter on stackup design so far."