Cascade Chapter of IPC Designers Council Meets Dec. 7

Reading time ( words)

The Cascade Chapter of the Designers Council's next Lunch and Learn meeting will take place December 7 at the Lake Washington Institute of Technology-Kirkland Campus (LWIT).

This meeting we will cover flex fabrication, materials, and techniques as well as some do's and don'ts. Jerome Larez, an application engineer with MicroConnex, will be the guest speaker for this event.

With the ever-increasing emphasis on IoT (Internet Of Things), the demand for flex circuits and designs is increasing rapidly. This will be an opportunity to get helpful insights into flex fabrication and learn how to avoid some common errors made by flex designers.

Following the meeting, there will be Altium User Group meeting for anyone who is interested. Stop by and become part of the conversation as Product Marketing Engineer David Haboud meets with local users and other industry advocates to discuss some of the toughest “how to” and “why” questions surrounding Altium Designer and the PCB design industry.

Presentation: Flex Printed Circuit Fabrication 

Speaker Jerome Larez will focus on flex printed circuit (FPC) fabrication. He will be discussing common materials used in FPC fabrication, including stiffeners and coverlays. Jerome will outline FPC fabrication techniques, how to better communicate your design requirements to fabricators, and some of the do’s and don’ts for FPC design.

Reserve a spot on your calendar on Friday, December 7 from 11:30 am to 1:30 pm for this educational Lunch and Learn event. The cost is $20 to cover the cost of lunch.

Location

Lake Washington Institute of Technology-Kirkland Campus
Room A102 (in the southeast corner of the building, on the 1st floor)
11605 132nd Ave NE
Kirkland, Washington 98034 

CID+ Class Rescheduled

There has been a change in the scheduling for the upcoming CID+ Class that had been scheduled for November 13-16. It has now been rescheduled for December 4-7, 2018, so be sure to sign up if you are interested in taking this advanced certification course, which will be at the same college as the upcoming chapter meeting, LWIT.

Also be sure to follow industry related magazines such as Design007 Magazine. The links to these sites can be found on our chapter web site: http://cascade-ipcdc.org

01/03/2019 | I-Connect007

Every year, we like to take a look back at the most popular PCB design news, articles, interviews, and columns. Without further ado, here are the top 10 most-read PCB design articles from the past year. Check them out.

09/12/2018 | Dave Wiens, Mentor, a Siemens Business

PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.

06/25/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits

The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.