Ventec to Focus on 5G, New Energy Vehicle and Mini LED Solutions at HKPCA 2018


Reading time ( words)

Ventec International Group Co., Ltd. will be showing latest PCB material solutions for 5G, new energy vehicle and mini LED applications on booth #6J11 at HKPCA, China, scheduled to take place December 5-7, 2018 at the Shenzhen Convention & Exhibition Center, China.

Ventec's team of materials experts will present the company’s next generation materials including the latest tec-speed 20.0 high-speed/low-loss material range that combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by 5G applications. Of course, with its full range of tec-speed products offering Df values ranging from 0.003 to 0.009, Ventec offers customers an excellent choice of materials fit for the 5G future of switch, data center, server, storage and handset applications.

Automotive and LED lighting and DC power conversion applications will also be a key show highlight featuring the latest advances in high performance IMS materials and thermally conductive prepregs and thin core laminates that deliver an exceptional thermal performance, reliability and quality.

With the rise in new energy vehicles, visitors to the booth will discover the latest developments in Ventec's advanced range of high thermal conductivity, low-loss, heavy copper and black laminates. These are all backed by fast availability and efficient delivery through Ventec's fully controlled global supply chain and technical support network.

About Ventec International Group

With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

Solder Mask Curing: UV Bump Overview

08/19/2019 | Nikolaus Schubkegel
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.

Avoiding CAF Failures at the IPC High-reliability Forum

12/31/1969 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.



Copyright © 2019 I-Connect007. All rights reserved.