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Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

What’s New in Design Education at IPC APEX EXPO?

04/11/2024 | Kelly Allen, IPC Training Manager
Kelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.

Design Community Town Hall Review 

04/11/2024 | Kelly Dack, CID+, EPTAC
The Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.

Connect the Dots: Designing for Reality: Prioritizing Manufacturability

04/11/2024 | Matt Stevenson -- Column: Connect the Dots
Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.

Quectel Introduces Versatile BG95-S5 NTN Satellite Communication Module

04/09/2024 | BUSINESS WIRE
Embedded World - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module. The module supports 3GPP Release 17 IoT-NTN in the S and L band frequencies for satellite communications. In addition, the multi-mode BG95-S5 supports LTE Cat M1, Cat NB2, eGPRS and integrated GNSS.
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