Zuken USA Issues Call for Papers for Zuken Innovation World 2019


Reading time ( words)

Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2019, to be held on April 15-17 in Hilton Head, South Carolina. The event includes a two-day technical conference and one-day exhibition to be held at the Hilton Head Marriott Resort & Spa.

Abstracts are now being accepted for 45-minute educational presentations. The technical program consists of four tracks focused on the following areas:

  • Board design, including SI/PI/EMC, ECAD/MCAD co-design and IC packaging
  • Electrical design including wire harness, panel and fluid design
  • Design data and library management, including supply chain and PLM integration
  • Innovative technologies and design methodologies, including Model Based Systems Engineering (MBSE)

Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest. Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.

Abstracts of 300 words, along with speaker biographies, should be submitted to Zuken by November 2, 2018. For additional details and deadline information, visit the ZIW Speakers’ Corner.

Education and Innovation

ZIW annually offers more than 40 technical sessions, including Zuken University classes showcasing how-to and best practices for the current and upcoming product releases. Zuken’s Expert Bar provides one-on-one access to Zuken’s technical team, while the Technology Showcase puts our partners’ innovative solutions front and center in a relaxed, interactive environment that encourages networking.

Share

Print


Suggested Items

EMA: Cadence Moves Simulation Further Up in the Design Cycle

03/15/2019 | Andy Shaughnessy, Design007 Magazine
Cadence Design Systems recently integrated more of its Sigrity capabilities into the front end of its PCB design tools. During DesignCon, Chris Banton of EMA Design Automation spoke with me about how this drive for “model-less analysis” benefits the PCB designer who can now access signal and power integrity, DFM, and electrical rule checking functionality early in the design process and have fewer issues later.

Words of Advice: What are Your Biggest Design Challenges?

03/11/2019 | Andy Shaughnessy, Design007 Magazine
In a recent survey, we asked the following question: What are your biggest design challenges? Here are just a few of the answers, edited slightly for clarity.

Todd Westerhoff Discusses His New Position and Much More

03/07/2019 | Andy Shaughnessy, Design007 Magazine
At DesignCon, I met with our old friend Todd Westerhoff, a veteran signal integrity engineer. Todd joined Mentor, a Siemens Business, since we last spoke. We discussed his new job responsibilities, his drive to get more designers and engineers to use SI tools, and the increasing value of cost-reduced design techniques versus overdesigning PCBs.



Copyright © 2019 I-Connect007. All rights reserved.