Occam Prize Competition for Electronic Design Now Accepting Entries


Reading time ( words)

The first annual Occam Prize International Design Competition has begun accepting registrations from circuit designers from around the world. Cash prizes totaling $5,000 will be awarded to top designers in the inaugural year of the planned annual competition.

The purpose of the competition is to incentivize circuit designers everywhere to explore for themselves the prospective benefits associated with the Occam Process, a method for manufacturing electronic assemblies without solder to prospectively make them smaller, lighter, more reliable, more environmentally friendly and much less expensive. It has been estimated by the developers that if all electronics were to be fabricated side stepping the solder assembly process, billions of dollars, perhaps into double digits could be saved annually on a global basis.

Veteran PCB designer Darren Smith, president of AthenaTech, demonstrated the efficacy of the Occam Design and Assembly Process by taking an assembly he had previously designed and redesigning it. Using the approach prescribed for Occam assemblies, Smith was able to take the assembly to less than half the size of the original while reducing layer count from 12 to 6.

For those wishing to better understand the Occam Process, Joe Fjelstad's eBook, “Solderless Assembly for Electronics – The SAFE Approach," is available for free download.

The Occam Prize will be awarded annually on December 21, Winter Solstice, the day the Northern Hemisphere begins to transition from days of darkness to days of light. Registrations open on August 14, 2018 and will close on November 30, 2018.

Sponsors presently include: AthenaTech - USA, CETTI - Romania, I-Connect007 - USA, MEPTEC - USA, Micropress - Brazil, Promex Industries - USA, Rainbow Technologies - Scotland, Verdant Electronics - USA, Tatsuta - Japan, Topline Industries - USA, Terecircuits - USA, UP Media - USA, and Zero Defects - USA.

Details about the Occam Prize and how to register can be found on the Occam Prize website or by contacting Info@OccamPrize.com.    

Share


Suggested Items

Simon Fried: Additive Manufacturing Through Printed Electronics

10/21/2018 | Barry Matties, Publisher, I-Connect007
Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.

Institute of Circuit Technology Hayling Island Seminar

10/10/2018 | Pete Starkey, I-Connect007
After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

Artificial Intelligence: More Questions than Answers

09/26/2018 | Dan Feinberg, Technology Editor, I-Connect007
I’ve been covering artificial intelligence (AI) and related technologies for years, particularly at events such as the annual Consumer Electronics Show (CES). As I write this, we are in the run-up to CES 2019, and the Artificial Intelligence Conference in San Francisco, so the AI landscape is likely to change—at an ever-accelerating rate. Let’s look at some of the challenges facing AI now, and then after CES 2019 we can take another look.



Copyright © 2018 I-Connect007. All rights reserved.