-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
CUI Partners with SnapEDA to Offer Free PCB Footprint Files
June 27, 2018 | CUI Inc.Estimated reading time: 2 minutes
CUI has teamed up with SnapEDA, the market-leading parts library for circuit board design, to provide designers with a catalog of free, ready-to-download PCB footprints and symbols for CUI’s range of board mount electromechanical components.
Circuit board design has historically been a time-consuming and challenging process due to the variety of product configurations and standards. With this partnership, users will be able to prevent footprint errors and design smarter, thanks to a library of verified PCB footprints and symbols readily available in all major CAD formats, including Altium, Eagle, KiCad, OrCAD/Allegro, PADS/DxDesigner, and PCB123.
“This partnership with SnapEDA is a continuation of CUI’s mission to equip our customers with necessary design tools and resources at every stage of the product development cycle,” said Jeff Schnabel, CUI’s VP of Global Marketing. “The addition of these PCB footprint files bolsters CUI’s already extensive catalog of ready-made 3D models, further streamlining the design process for engineers,” Schnabel concluded.
The files are free to download from CUI’s CAD model library and product pages, or via the SnapEDA website, where they can then be placed directly into a product’s design.
“We are committed to building the industry’s largest, verified library of component models. Adding CUI and their broad portfolio of board level components to our catalog supplies yet another source from which engineers can gather PCB files for seamless integration into their designs,” said Natasha Baker, CEO of SnapEDA.
About SnapEDA
SnapEDA is the Internet’s first and leading parts library for circuit board design. By providing ready-to-use building blocks for circuit board design via our website and plugins for PCB design tools, we shave days off product development, so that designers can focus on product optimization and innovation. Over half a million engineers use SnapEDA each year, evaluating nearly two million electronic components. These engineers are making everything from medical devices, to electric airplanes. SnapEDA is funded by Y Combinator and private investors. Visit www.snapeda.com.
About CUI Inc
CUI is an electronic components manufacturer specializing in a diverse range of product technologies. As a leader in power electronics, the organization supports customers as they strive to improve the energy efficiency and environmental credentials of their application. The company’s interconnect, audio, motion and thermal management groups provide engineers with reliable and proven solutions across a range of market segments as technology allows the world to connect in new ways. An unwavering commitment to the design engineer has been a hallmark of CUI’s sustained growth since its founding in 1989 and will continue to be the primary mission as they expand their product technologies, manufacturing capabilities and global reach. Visit www.cui.com.
CUI Inc is a subsidiary of CUI Global, Inc., a publicly traded company whose common stock trades on the NASDAQ Exchange under the symbol CUI.
Suggested Items
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/12/2024 | Nolan Johnson, I-Connect007As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.