Still Using 1980s Formats for Design Data Handoff?


Reading time ( words)

The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted.

Today, the consortium consists of more than 90 corporate member companies with a single goal: migrate PCB design handoff from an assortment of unintelligent photoplot data to a single, intelligent file. Members from all electronics industry segments—design, manufacturing and supply chain—have collaborated to create an open format that also supports stack-up data exchange between design houses and their fabrication partners.

Fabricators and assembly houses have reported that using a single file results in a 30% time savings compared to using multiple Gerber files and many other similar file formats. PCB designers and their partners are breathing a sigh of relief knowing that IPC-2581 eliminates the risks of mismatched data on both sides of the design process.

The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members, who represent a variety of PCB design and supply chain companies:

  • PCB ECAD companies, including Altium, Cadence, Mentor, Zuken, ADIVA, DownStream Technologies, and WISE Software
  • EMS companies, contract manufacturers, and fabrication companies
  • Companies that provide software to EMS, fabrication and contract manufacturers, including AEGIS, Cimnet, Direct Logix, Easy Logix, GraphiCode, and Polar Instruments
  • And, of course, IPC

To read this entire article, which appeared in the February 2018 issue of Design007 Magazine, click here.

Share

Print


Suggested Items

Mentor and Z-zero Collaborate on New Stackup Tool

09/17/2020 | Andy Shaughnessy, Design007 Magazine
I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi

09/09/2020 | I-Connect007 Editorial Team
The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

Just Ask Happy: The Exclusive Compilation

08/13/2020 | Happy Holden, I-Connect007
We asked for you to send in your questions for Happy Holden, and you took us up on it! We loved them so much, and we know that you did too, so we’ve compiled all 21 questions and answers into one document for easy reference.



Copyright © 2020 I-Connect007. All rights reserved.