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During IPC APEX EXPO 2018, Polar Instruments' Lupita Maurer and Geoffrey Hazelett sat down with Editor Andy Shaughnessy to discuss upgrades to their SpeedStack tool and Lupita's new position with the company.
To watch this video, click here.
Visit I-007eBooks to download your copies of Polar Instruments micro eBooks today:
The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs, Part 1
The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs, Part 2
Max Clark, Mentor, a Siemens Business
The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance.
Andy Shaughnessy, Design007 Magazine
I sat down for an interview with Leo Lambert, VP of technical director for EPTAC Corporation, during the IPC Summer Meetings in Raleigh, North Carolina. We discussed the company’s growth, including plans to have training centers across different regions of the country to help cut down on students’ travel times, and why training methods must constantly evolve to remain effective.
Mike Creeden, CID+, Insulectro
I recently spoke with Insulectro’s Chris Hunrath and DuPont’s Steven Bowles at the DuPont Technology and Innovation Center in Sunnyvale, California. We discussed a variety of topics related to flex design, including the support structure that’s needed in flex design, the everchanging world of flex materials, and the need for working with a flex fabricator as early as possible in the flex design cycle.